The ceramic substrates include copper layers for fabrication of circuit patterns heat sinks and other electronic structures.
Ceramic substrate material.
Alumina and aln have been used for a long time as the standard substrate materials for fabricating electronic circuits in thick film technology.
At present the ceramic substrate materials used include alumina beryllium oxide aluminum nitride silicon carbide and mullite.
In terms of structure and manufacturing process ceramic substrates can be divided into high temperature co firing multi layer ceramic substrates low temperature co firing ceramic substrates thick film ceramic substrates etc.
The porous alumina substrates are often used as sintering base with the thermal treatment to 1500 c.
Ceramic materials include alumina al2o3 aluminum nitride aln and silicon nitride si3n4.
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Zro 2 substrate have a high corrosion and abrasion resistance.
Ceramic substrates such as alumina aluminum nitride and beryllium oxide are highly thermally conductive materials which transfer heat away from hot spots quickly and efficiently dissipating it over the whole surface.
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Among the ceramics employed as electronic substrates and packages the dominant material is alumina aluminum oxide al 2 o 3.
The advantages of alumina include high resistivity good mechanical and dielectric strength excellent thermal and corrosion stability and the ability to provide hermetic seals.
Aln substrate have a high oxidation and abrasion resistance.
Keral 99 is a high alumina substrate material with 99 7 purity.
Beside this conventional application these ceramics have been proved as excellent substrate materials for thick film heater employments.
The dielectric strength is the highest of kerafol s ceramic substrate materials.
Substrates made from rubalit alumina ceramics rubalit 708 s with 96 al 2 o 3 this ceramic material is characterized by its extremely high strength and thermal conductivity.
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